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Description:
d>| BGA Ball Diameter: | 0.40mm (16mil)minimum, 1.00mm(40mil)maximum |
| QFP Lead Pitch: | 0.38mm(15.2mil)minimum, 2.54mm(100mil)maximum |
| Frequency of Stencil Cleaning: | 1 time/5 to 10 pieces |
If you need to get a formal quoation, please provide thespec as below:
1. PCB files in gerber file
2. Parts list(BOM list)
Welcome to contact Fulltronics team. We are here ready to assistyou with our professional skills and cheerful services.
Double sided PCB and Assembly service, components sourcing_ROHS/UL/IPC/ISO/SGS
